Semiconductor device and method of manufacturing the same

ABSTRACT

A semiconductor device, and a method of manufacturing the same, includes first and second gate structures extending in a first direction and spaced apart from each other in a second direction intersecting the first direction, a dummy gate structure provided between the first and second gate structures, a first source/drain region between the first gate structure and the dummy gate structure, a second source/drain region between the second gate structure and the dummy gate structure, a connection contact provided on the dummy gate structure, and a common conductive line provided on the connection contact. The dummy gate structure extends in the first direction. The connection contact extends in the second direction to connect the first source/drain region to the second source/drain region. The common conductive line configured to a voltage to the first and second source/drain regions through the connection contact.

CROSS-REFERENCE TO RELATED APPLICATION

This U.S. non-provisional patent application claims priority under 35U.S.C. §119 to Korean Patent Application No. 10-2014-0132459, filed onOct. 1, 2014, in the Korean Intellectual Property Office, the disclosureof which is hereby incorporated by reference in its entirety.

BACKGROUND

1. Field

Some example embodiments of the inventive concepts relate to asemiconductor device and/or a method of manufacturing the same. Moreparticularly, some example embodiments of the inventive concepts relateto a semiconductor device including a plurality of standard cells and/ora method of manufacturing the same.

2. Description of Related Art

Semiconductor devices are widely used in an electronic industry becauseof their small sizes, multi-functional characteristics, and/or lowmanufacture costs. Semiconductor devices may be categorized as any oneof semiconductor memory devices storing logical data, semiconductorlogic devices processing operations of logical data, and hybridsemiconductor devices having both the function of the semiconductormemory devices and the function of the semiconductor logic devices.Semiconductor devices with excellent characteristics have been demandedwith the development of the semiconductor devices. For example,high-reliable, high-speed, and/or multi-functional semiconductor deviceshave been increasingly demanded. To satisfy these demands, structures ofsemiconductor devices have been complicated and semiconductor deviceshave been highly integrated.

SUMMARY

Some example embodiments of the inventive concepts may provide asemiconductor device capable of reducing a manufacture cost and/or amethod of manufacturing the same.

Some example embodiments of the inventive concepts may also provide asemiconductor device capable of being easily manufactured and/or amethod of manufacturing the same.

According to some example embodiments, a semiconductor device includes afirst gate structure and a second gate structure extending in a firstdirection and spaced apart from each other in a second directionintersecting the first direction; a dummy gate structure between thefirst gate structure and the second gate structure and extending in thefirst direction; a first source/drain region between the first gatestructure and the dummy gate structure; a second source/drain regionbetween the second gate structure and the dummy gate structure; aconnection contact on the dummy gate structure, the connection contactextending in the second direction to connect the first source/drainregion to the second source/drain region; and a common conductive lineon the connection contact, the common conductive line configured toapply a voltage to the first and second source/drain regions through theconnection contact.

In some example embodiments, the connection contact may include ahorizontal extension extending in the second direction; and verticalextensions extending from the horizontal extension to top surfaces ofthe first and second source/drain regions, respectively. Bottom surfacesof the vertical extensions may be in contact with the first and secondsource/drain regions, respectively.

In some example embodiments, a bottom surface of the horizontalextension may be in contact with a top surface of the dummy gatestructure.

In some example embodiments, the semiconductor device may furtherinclude a via-contact between the connection contact and the commonconductive line. The common conductive line may be for applying the samevoltage to the first and second source/drain regions through thevia-contact and the connection contact.

In some example embodiments, the semiconductor device may furtherinclude a third source/drain region between the first gate structure andthe dummy gate structure, the third source/drain region being spacedapart from the first source/drain region in the first direction; afourth source/drain region between the second gate structure and thedummy gate structure, the fourth source/drain region spaced apart fromthe second source/drain region in the first direction; a first contactbetween the first gate structure and the dummy gate structure, the firstcontact being in contact with the third source/drain region; and asecond contact between the second gate structure and the dummy gatestructure, the second contact being in contact with the fourthsource/drain region. Top surfaces of the first and second contacts maybe disposed at a substantially same level as a top surface of theconnection contact.

In some example embodiments, the first contact, the second contact, andthe connection contact may include identical materials.

In some example embodiments, the first and second contacts may have barshapes extending in the first direction, and may be spaced apart fromthe connection contact in the first direction.

In some example embodiments, each of the first contact, the secondcontact, and the connection contact may have a width in the seconddirection, and the width of the connection contact may be greater thanthe widths of the first and second contacts.

According to other example embodiments, a semiconductor device includesa dummy gate structure on a substrate, the dummy gate structureextending in a first direction; a first pair of transistors atrespective opposing sides of the dummy gate structure; a second pair oftransistors at the respective opposing sides, the second pair oftransistors being adjacent to the first pair of transistors in the firstdirection; a connection contact on a top surface of the dummy gatestructure, the connection contact extending along both sidewalls of thedummy gate structure so as to be connected in common to the first pairof transistors; and a first contact and a second contact at therespective opposing sides. The first and second contacts may beconnected to the second pair of transistors, respectively. Top surfacesof the first and second contacts may be disposed at a substantially samelevel as a top surface of the connection contact.

In some example embodiments, the semiconductor device may furtherinclude a plurality of logic cells on the substrate. The plurality oflogic cells may include a first logic cell; and a second logic cellspaced apart from the first logic cell in the first direction. The dummygate structure may intersect the first logic cell and the second logiccell. The first logic cell may include the first pair of transistors,and the second logic cell may include the second pair of transistors.

In some example embodiments, the semiconductor device may furtherinclude a via-contact in contact with the top surface of the connectioncontact; and a common conductive line in contact with a top surface ofthe via-contact. The common conductive line may apply a drain voltage ora source voltage to the first pair of transistors through thevia-contact and the connection contact.

In some example embodiments, the semiconductor device may furtherinclude a plurality of logic cells on the substrate, and the pluralityof logic cells may include a first logic cell; a second logic cellspaced apart from the first logic cell in a second directionintersecting the first direction; a third logic cell spaced apart fromthe first logic cell in the first direction; and a fourth logic cellspaced apart from the second logic cell in the first direction. Thedummy gate structure may be disposed between the first logic cell andthe second logic cell, and between the third logic cell and the fourthlogic cell. The first pair of transistors may include a first transistorin the first logic cell; and a second transistor in the second logiccell. The second pair of transistors may include a third transistor inthe third logic cell; and a fourth transistor in the fourth logic cell.

In some example embodiments, the semiconductor device may furtherinclude a via-contact in contact with the top surface of the connectioncontact; and a common conductive line in contact with a top surface ofthe via-contact. The common conductive line may be shared by the firstlogic cell and the second logic cell.

In some example embodiments, the common conductive line may beconfigured to apply the same voltage (a drain voltage or a sourcevoltage) to the first and second transistors through the via-contact andthe connection contact.

In some embodiments, the first contact, the second contact, and theconnection contact may include identical materials.

According to yet some example embodiments, a method of manufacturing asemiconductor device includes forming a dummy gate structure extendingin a first direction on a substrate; forming a first pair of transistorsspaced apart from each other with the dummy gate structure interposedtherebetween; forming a second pair of transistors spaced apart fromeach other with the dummy gate structure interposed therebetween, thesecond pair of transistors being adjacent to the first pair oftransistors in the first direction; forming an interlayer insulatinglayer covering the dummy gate structure and the transistors on thesubstrate; patterning the interlayer insulating layer to form a firsthole and a second hole that expose one-terminals respectively includedin the second pair of transistors; patterning the interlayer insulatinglayer to form a third hole exposing a top surface of the dummy gatestructure and one-terminals respectively included in the first pair oftransistors; and forming a first contact, a second contact, and aconnection contact in the first hole, the second hole, and the thirdhole, respectively. The first hole, the second hole, and the third holemay be formed using different photo masks from each other. Top surfacesof the first contact, the second contact, and the connection contact maybe disposed at the same height from the substrate.

According to further example embodiments, a semiconductor deviceincludes first and second gate structures extending in a firstdirection. The first gate structure is electrically connected to a firstsource/drain region and a second source/drain region, and the secondgate structure is electrically connected to a third source/drain regionand a fourth source/drain region. The semiconductor device furtherincludes a connection contact electrically connecting the firstsource/drain region to the third source/drain region. The connectioncontact extends in the first direction.

The semiconductor device may further include a dummy gate structureinterposed between the first and third source/drain regions, and betweenthe second and fourth source/drain region. The dummy gate structure mayextend in the first direction. The connection contact may traverse thedummy gate structure along a second direction, the second directionbeing substantially perpendicular to the first direction.

The semiconductor device may further include first and second contactseach electrically connected to a respective one of the second and fourthsource/drain regions. Upper surfaces of the first and second contactsmay be coplanar with an upper surface of the connection contact.

The semiconductor device may further include a common conductive lineelectrically connected to the first and second gate structures via theconnection contact and a respective one of the first and thirdsource/drain regions.

BRIEF DESCRIPTION OF THE DRAWINGS

Example embodiments of the inventive concepts will become more apparentin view of the attached drawings and accompanying detailed description.

FIG. 1 is a plan view illustrating a semiconductor device according tosome example embodiments of the inventive concepts;

FIG. 2 is a plan view partially illustrating logic cells of FIG. 1;

FIGS. 3A, 3B, 3C, and 3D are cross-sectional views taken along linesI-I′, II-II′, III-III′, and IV-IV′ of FIG. 2, respectively;

FIGS. 4A, 5A, 6A, 7A and 8A are cross-sectional views corresponding tothe line I-I′ of FIG. 2 to illustrate a method of manufacturing asemiconductor device according to some example embodiments of theinventive concepts;

FIGS. 4B, 5B, 6B, 7B and 8B are cross-sectional views corresponding tothe line II-Ii′ of FIG. 2 to illustrate a method of manufacturing asemiconductor device according to some example embodiments of theinventive concepts;

FIGS. 4C, 5C, 6C, 7C and 8C are cross-sectional views corresponding tothe line III-III′ of FIG. 2 to illustrate a method of manufacturing asemiconductor device according to some example embodiments of theinventive concepts;

FIGS. 4D, 5D, 6D, 7D and 8D are cross-sectional views corresponding tothe line IV-IV′ of FIG. 2 to illustrate a method of manufacturing asemiconductor device according to some example embodiments of theinventive concepts;

FIG. 9 is a conceptual diagram illustrating an active pattern of asemiconductor device according to some example embodiments of theinventive concepts;

FIG. 10 is a conceptual diagram illustrating an active pattern of asemiconductor device according to still other example embodiments of theinventive concepts; and

FIG. 11 is a schematic block diagram illustrating an electronic systemincluding a semiconductor device according to some example embodimentsof the inventive concepts.

DETAILED DESCRIPTION OF THE EXAMPLE EMBODIMENTS

Various example embodiments will now be described more fully withreference to the accompanying drawings in which some example embodimentsare shown. However, specific structural and functional details disclosedherein are merely representative for purposes of describing exampleembodiments. Thus, the invention may be embodied in many alternate formsand should not be construed as limited to only example embodiments setforth herein. Therefore, it should be understood that there is no intentto limit example embodiments to the particular forms disclosed, but onthe contrary, example embodiments are to cover all modifications,equivalents, and alternatives falling within the scope.

In the drawings, the thicknesses of layers and regions may beexaggerated for clarity, and like numbers refer to like elementsthroughout the description of the figures.

Although the terms first, second, etc. may be used herein to describevarious elements, these elements should not be limited by these terms.These terms are only used to distinguish one element from another. Forexample, a first element could be termed a second element, and,similarly, a second element could be termed a first element, withoutdeparting from the scope of example embodiments. As used herein, theterm “and/or” includes any and all combinations of one or more of theassociated listed items.

It will be understood that, if an element is referred to as being“connected” or “coupled” to another element, it can be directlyconnected, or coupled, to the other element or intervening elements maybe present. In contrast, if an element is referred to as being “directlyconnected” or “directly coupled” to another element, there are nointervening elements present. Other words used to describe therelationship between elements should be interpreted in a like fashion(e.g., “between” versus “directly between,” “adjacent” versus “directlyadjacent,” etc.).

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of exampleembodiments. As used herein, the singular forms “a,” “an” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“comprises,” “comprising,” “includes” and/or “including,” if usedherein, specify the presence of stated features, integers, steps,operations, elements and/or components, but do not preclude the presenceor addition of one or more other features, integers, steps, operations,elements, components and/or groups thereof.

Spatially relative terms (e.g., “beneath,” “below,” “lower,” “above,”“upper” and the like) may be used herein for ease of description todescribe one element or a relationship between a feature and anotherelement or feature as illustrated in the figures. It will be understoodthat the spatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, for example, the term “below” can encompass both anorientation that is above, as well as, below. The device may beotherwise oriented (rotated 90 degrees or viewed or referenced at otherorientations) and the spatially relative descriptors used herein shouldbe interpreted accordingly.

Example embodiments are described herein with reference tocross-sectional illustrations that are schematic illustrations ofidealized embodiments (and intermediate structures). As such, variationsfrom the shapes of the illustrations as a result, for example, ofmanufacturing techniques and/or tolerances, may be expected. Thus,example embodiments should not be construed as limited to the particularshapes of regions illustrated herein but may include deviations inshapes that result, for example, from manufacturing. For example, animplanted region illustrated as a rectangle may have rounded or curvedfeatures and/or a gradient (e.g., of implant concentration) at its edgesrather than an abrupt change from an implanted region to a non-implantedregion. Likewise, a buried region formed by implantation may result insome implantation in the region between the buried region and thesurface through which the implantation may take place. Thus, the regionsillustrated in the figures are schematic in nature and their shapes donot necessarily illustrate the actual shape of a region of a device anddo not limit the scope.

It should also be noted that in some alternative implementations, thefunctions/acts noted may occur out of the order noted in the figures.For example, two figures shown in succession may in fact be executedsubstantially concurrently or may sometimes be executed in the reverseorder, depending upon the functionality/acts involved.

As appreciated by the present inventive entity, devices and methods offorming devices according to various example embodiments describedherein may be embodied in microelectronic devices such as integratedcircuits, wherein a plurality of devices according to various exampleembodiments described herein are integrated in the same microelectronicdevice. Accordingly, the cross-sectional view(s) illustrated herein maybe replicated in two different directions, which need not be orthogonal,in the microelectronic device. Thus, a plan view of the microelectronicdevice that embodies devices according to various example embodimentsdescribed herein may include a plurality of the devices in an arrayand/or in a two-dimensional pattern that is based on the functionalityof the microelectronic device.

The devices according to various example embodiments described hereinmay be interspersed among other devices depending on the functionalityof the microelectronic device. Moreover, microelectronic devicesaccording to various example embodiments described herein may bereplicated in a third direction that may be orthogonal to the twodifferent directions, to provide three-dimensional integrated circuits.

Accordingly, the cross-sectional view(s) illustrated herein providesupport for a plurality of devices according to various exampleembodiments described herein that extend along two different directionsin a plan view and/or in three different directions in a perspectiveview. For example, when a single active region is illustrated in across-sectional view of a device/structure, the device/structure mayinclude a plurality of active regions and transistor structures (ormemory cell structures, gate structures, etc., as appropriate to thecase) thereon, as would be illustrated by a plan view of thedevice/structure.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which example embodiments belong. Itwill be further understood that terms, such as those defined in commonlyused dictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

In order to more specifically describe example embodiments, variousfeatures will be described in detail with reference to the attacheddrawings. However, example embodiments described are not limitedthereto.

FIG. 1 is a plan view illustrating a semiconductor device according tosome example embodiments of the inventive concepts.

Referring to FIG. 1, a semiconductor device according to some exampleembodiments may include a plurality of logic cells C1, C2, C3, and C4provided on a substrate. Each of the logic cells C1, C2, C3, and C4 mayinclude a plurality of transistors. In some example embodiments, thesemiconductor device may include a first logic cell C1, a third logiccell C3 spaced apart from the first logic cell C1 in a first directionD1, a second logic cell C2 spaced apart from the first logic cell C1 ina second direction D2 intersecting the first direction D1, and a fourthlogic cell C4 spaced apart from the third logic cell C3 in the seconddirection D2. The fourth logic cell C4 may be spaced apart from thesecond logic cell C2 in the first direction D1. A cell boundary CB maybe defined between the logic cells C1, C2, C3, and C4 adjacent to eachother.

Each of the logic cells C1, C2, C3, and C4 may include active regionsthat are separated from each other by a device isolation layer ST. Eachof the logic cells C1, C2, C3, and C4 may include a P-typemetal-oxide-semiconductor field effect transistor (PMOSFET) region PRand an N-type metal-oxide-semiconductor field effect transistor(NMOSFET) region NR. The PMOSFET region PR and the NMOSFET region NR ofeach of the logic cells C1, C2, C3, and C4 may be separated from eachother by the device isolation layer ST.

In some example embodiments, the PMOSFET region PR and the NMOSFETregion NR may be spaced apart from each other in the first direction D1.The PMOSFET region PR of the first logic cell C1 may be adjacent to thePMOSFET region PR of the third logic cell C3 in the first direction D1.In the present specification, the logic cell may be defined as a unitthat performs one Boolean logic function (e.g., INVERTER, AND, OR, NAND,or NOR), or one storage function (e.g., FLIP-FLOP). Four logic cells C1,C2, C3, and C4 are illustrated in FIG. 1. However, example embodimentsof the inventive concepts are not limited to the number of the logiccells.

FIG. 2 is a plan view partially illustrating logic cells of FIG. 1.FIGS. 3A, 3B, 3C, and 3D are cross-sectional views taken along linesI-I′, II-II′, III-III′, and IV-IV′ of FIG. 2, respectively.

Hereinafter, example embodiments of the inventive concepts will bedescribed on the basis of the first logic cell C1. However, other logiccells C2, C3, and C4 may have the same structure as, or a correspondingstructure to, the first logic cell C1.

Referring to FIGS. 1, 2, 3A, 3B, 3C, and 3D, the first logic cell C1 mayinclude the PMOSFET region PR and the NMOSFET region NR which areseparated from each other by the device isolation layer ST. The firstlogic cell C1 may be separated from other logic cells C2, C3, and C4adjacent thereto by the device isolation layer ST.

Referring to FIG. 2, the device isolation layer ST may include a firstdevice isolation layer ST1 separating the PMOSFET region PR from theNMOSFET region NR, and a second device isolation layer ST2 separatingthe first logic cell C1 from the logic cells C2, C3, and C4 adjacent tothe first logic cell C1. The first device isolation layer ST1 and thesecond device isolation layer ST2 may be connected to each other toconstitute one united body. The device isolation layer ST may be formedin an upper portion of the substrate 100. For example, the substrate 100may be a silicon substrate, a germanium substrate, or asilicon-on-insulator (SOI) substrate. The device isolation layer ST mayinclude, for example, a silicon oxide layer.

According to some example embodiments, the PMOSFET region PR and theNMOSFET region NR may be spaced apart from each other in the firstdirection D1 with the first device isolation layer ST1 interposedtherebetween. As illustrated in FIG. 2, each of the PMOSFET region PRand the NMOSFET region NR may be provided in plurality in the firstlogic cell C1. The plurality of PMOSFET regions PR may be separated fromeach other by the first device isolation layer ST1, and the plurality ofNMOSFET regions NR may also be separated from each other by the firstdevice isolation layer ST1.

Referring to FIG. 3C, the first logic cell C1 may include a plurality ofactive patterns AP that are provided on the substrate 100 to extend inthe second direction D2. The active patterns AP may be arranged alongthe first direction D1. According to some example embodiments, thirddevice isolation layers ST3 extending in the second direction D2 may bedisposed at both sides of each of the active patterns AP. In someexample embodiments, each of the active patterns AP may have an upperportion (hereinafter, referred to as ‘an active fin AF’) exposed by thethird device isolation layers ST3. However, example embodiments of theinventive concepts are not limited thereto. In other exampleembodiments, top surfaces of the active pattern AP may be substantiallycoplanar with top surfaces of the third device isolation layers ST3.

The first, second, and third device isolation layers ST1, ST2, and ST3may have depths in a direction perpendicular to the top surface of thesubstrate 100. According to some example embodiments, the depths of thethird device isolation layers ST3 may be smaller than those of the firstand second device isolation layers ST1 and ST2. In this case, the thirddevice isolation layers ST3 may be formed by an additional processdifferent from a process of forming the first and second deviceisolation layers ST1 and ST2. According to other example embodiments,the third device isolation layers ST3 may be formed simultaneously withthe first and second device isolation layers ST1 and ST2. In this case,the depths of the third device isolation layers ST3 may be substantiallyequal to those of the first and second device isolation layers ST1 andST2.

The active patterns AP may be provided on each of the PMOSFET region PRand the NMOSFET region NR. As illustrated in FIG. 2, three activepatterns AP may be disposed on each of the PMOSFET region PR and theNMOSFET region NR. However, example embodiments of the inventiveconcepts are not limited thereto.

Referring to FIGS. 3A and 3B, gate structures G may be disposed on theactive patterns AP. The gate structures G may extend in the firstdirection D1 to cross over the active patterns AP. The gate structures Gmay extend in the first direction D1 to intersect the PMOSFET region PRand the NMOSFET region NR, and may be arranged in the second directionD2. The gate structures G may extend in the first direction D1 tointersect the first logic cell C1 and the third logic cell C3 which areadjacent to each other in the first direction D1. Each of the gatestructures G may include a gate insulating pattern 102, a gate electrode110, and a capping pattern 104 which are sequentially stacked on thesubstrate 100. The gate insulating pattern 102 may include at least oneof a silicon oxide layer, a silicon oxynitride layer, or a high-kdielectric layer of which a dielectric constant is higher than that of asilicon oxide layer. The gate electrode 110 may include at least one ofa doped semiconductor, a metal, or a conductive metal nitride. Thecapping pattern 104 may include at least one of a silicon oxide layer, asilicon nitride layer, or a silicon oxynitride layer. Each of the gatestructures G may further include gate spacers 106 that are provided onboth sidewalls of the gate electrode 110. The gate spacers 106 mayinclude at least one of a silicon oxide layer, a silicon nitride layer,or a silicon oxynitride layer.

A dummy gate structure DG may be provided between a pair of gatestructures G adjacent to each other. The dummy gate structure DG mayextend in the first direction D1. The pair of gate structures G mayinclude a first gate structure G1 disposed at one side of the dummy gatestructure DG, and a second gate structure G2 disposed at another side ofthe dummy gate structure DG. The first gate structure G1 and the secondgate structure G2 may be adjacent to each other with the dummy gatestructure interposed therebetween.

According to some example embodiments, the dummy gate structure DG mayextend in the first direction D1 to intersect the first logic cell C1and the third logic cell C3, as illustrated in FIG. 2. In other words,the first gate structure G1, the second gate structure G2, and the dummygate structure DG may intersect two cells C1 and C3 adjacent to eachother. In this case, the first gate structure G1, the second gatestructure G2, and the dummy gate structure DG may intersect the cellboundary CB between the two cells C1 and C3.

According to other example embodiments, the dummy gate structure DG maybe provided between the first logic cell C1 and the second logic cell C2adjacent to the first logic cell C1 in the second direction D2, asillustrated in FIG. 2. The dummy gate structure DG may extend in thefirst direction D1, so it may also be disposed between the third logiccell C3 and the fourth logic cell C4. In other words, the dummy gatestructure DG may be disposed on the cell boundary CB between the firstand second logic cells C1 and C2, and between the third and fourth logiccells C3 and C4. In this case, the first gate structure G1 may intersectthe first and third logic cells C1 and C3 adjacent to each other in thefirst direction D1, and the second gate structure G2 may intersect thesecond and fourth logic cells C2 and C4 adjacent to each other in thefirst direction D1.

The dummy gate structure DG may include the same materials as each ofthe gate structures G. For example, the dummy gate structure DG mayinclude a gate insulating pattern 102, a dummy gate pattern 110D, and acapping pattern 104 which are sequentially stacked on the substrate 100.The dummy gate structure DG may further include gate spacers 106provided on both sidewalls of the dummy gate pattern 110D. The dummygate pattern 110D may include at least one of, for example, a dopedsemiconductor, a metal, or a conductive metal nitride.

Source/drain regions SD may be provided in the active patterns AP atboth sides of each of the gate structures G. As illustrated in FIG. 3C,the source/drain regions SD may be confined in the active fins AF.Alternatively, the source/drain regions SD may extend downward betweenthe third device isolation layers ST3. The source/drain regions SDdisposed in the PMOSFET region PR may be P-type dopant regions, and thesource/drain regions SD disposed in the NMOSFET region NR may be N-typedopant regions. Portions of the active patterns AP (e.g., portions ofthe active fins AF), which are disposed under and overlap with each ofthe gate structures G, may be used as channel regions.

As shown in FIG. 3A, the source/drain regions SD may include firstsource/drain regions SD1 provided at both sides of the first gatestructure G1, and second source/drain regions SD2 provided at both sidesof the second gate structure G2. A first transistor TR1 may be definedby the first gate structure G1 and the first source/drain regions SD1,and a second transistor TR2 may be defined by the second gate structureG2 and the second source/drain regions SD2. The first transistor TR1 andthe second transistor TR2 may be adjacent to each other with the dummygate structure DG interposed therebetween.

As shown in FIG. 3B, the source/drain regions SD may further includethird source/drain regions SD3 and fourth source/drain regions SD4. Thethird source/drain regions SD3 may be provided at both sides of thefirst gate structure G1, and may be spaced apart from the firstsource/drain regions SD1 in the first direction D1. The fourthsource/drain regions SD4 may be provided at both sides of the secondgate structure G2, and may be spaced apart from the second source/drainregions SD2 in the first direction D1. A third transistor TR3 may bedefined by the first gate structure G1 and the third source/drainregions SD3, and a fourth transistor TR4 may be defined by the secondgate structure G2 and the fourth source/drain regions SD4. The thirdtransistor TR3 and the fourth transistor TR4 may be adjacent to eachother with the dummy gate structure DG interposed therebetween. Thethird transistor TR3 and the fourth transistor TR4 may be spaced apartfrom the first transistor TR1 and the second transistor TR2 in the firstdirection D1, respectively.

As shown in FIG. 2, according to some example embodiments, the firstgate structure G1, the second gate structure G2, and the dummy gatestructure DG may intersect the two cells C1 and C3 adjacent to eachother. In this case, the first and second source/drain regions SD1 andSD2 may be provided in the first logic cell C1, and the third and fourthsource/drain regions SD3 and SD4 may be provided in the third logic cellC3. In other words, the first and second transistors TR1 and TR2 maycorrespond to a first pair of transistors included in the first logiccell C1, and the third and fourth transistors TR3 and TR4 may correspondto a second pair of transistors included in the third logic cell C3. Thefirst pair transistors may be adjacent to the second pair of thetransistors with the cell boundary CB, disposed between the two cells C1and C3, interposed therebetween.

According to other example embodiments, the dummy gate structure DG maybe provided on the cell boundary CB between the first logic cell C1 andthe second logic cell C2, and between the third logic cell C3 and thefourth logic cell C4. The first gate structure G1 may intersect thefirst and third logic cells C1 and C3 adjacent to each other in thefirst direction D1, and the second gate structure G2 may intersect thesecond and fourth logic cells C2 and C4 adjacent to each other in thefirst direction D1. In this case, the first source/drain regions SD1 maybe provided in the first logic cell C1, and the second source/drainregions SD2 may be provided in the second logic cell C2. The thirdsource/drain regions SD3 may be provided in the third logic cell C3, andthe fourth source/drain regions SD4 may be provided in the fourth logiccell C4. In other words, the first, second, third, and fourthtransistors TR1, TR2, TR3, and TR4 may be included in the first, second,third, and fourth logic cells C1, C2, C3, and C4, respectively. Thefirst, second, third, and fourth transistors TR1, TR2, TR3, and TR4 maybe adjacent to each other with the cell boundary CB, disposed betweenthe first to fourth logic cells C1, C2, C3, and C4, interposedtherebetween.

Source/drain contacts 156 may be provided at both sides of each of thegate structures G. The source/drain contacts 156 may be electricallyconnected to the source/drain regions SD. In some example embodiments,the source/drain contacts 156 may be in direct contact with thesource/drain regions SD. At least one of the source/drain contacts 156may connect a plurality of the source/drain regions SD spaced apart fromeach other in the first direction D1 to each other. For example, one ormore of the source/drain contacts 156 may connect the source/drainregions SD, which are arranged in the first direction D1 in the PMOSFETregion PR, to each other. Likewise, one or more of the source/draincontacts 156 may connect the source/drain regions SD, which are arrangedin the first direction D1 in the NMOSFET region NR, to each other. Eventhough not shown in the drawings, one or more of the source/draincontacts 156 may extend on the device isolation layer ST to connect thesource/drain region SD of the PMOSFET region PR to the source/drainregion SD of the NMOSFET region NR. The source/drain contacts 156 mayhave various shapes. For example, one or more of the source/draincontacts 156 may have a bar shape extending in the first direction D1when viewed from a plan view. The source/drain contacts 156 may includeat least one of, but not limited to, a doped semiconductor, a metal, ametal silicide, or a conductive metal nitride.

As shown in FIG. 3A, a connection contact 150 may be provided on thedummy gate structure DG. The connection contact 150 may connect thefirst source/drain region SD1 between the first gate structure G1 andthe dummy gate structure DG to the second source/drain region SD2between the second gate structure G2 and the dummy gate structure DG.The connection contact 150 may include a horizontal extension HEprovided on the top surface of the dummy gate structure DG to extend inthe second direction D2, and vertical extensions VE extending from thehorizontal extension HF to the top surfaces of the first and secondsource/drain regions SD1 and SD2, respectively. The vertical extensionsVE may extend from the horizontal extension HE along both sidewalls ofthe dummy gate structure DG so as to be connected to the first andsecond source/drain regions SD1 and SD2, respectively. Bottom surfacesof the vertical extensions VE may be in contact with the first andsecond source/drain regions SD1 and SD2, respectively. According to someexample embodiments, a bottom surface of the horizontal extension HE maybe in contact with the top surface of the dummy gate structure DG.

A top surface 150U of the connection contact 150 may be disposed at thesubstantially same level as top surfaces 156U of the source/draincontacts 156. The connection contact 150 may include the same materialas the source/drain contacts 156. For example, the connection contact150 may include at least one of a doped semiconductor, a metal, a metalsilicide, or a conductive metal nitride.

The source/drain contacts 156 may include a first contact 156 aconnected to the third source/drain region SD3 disposed between thefirst gate structure G1 and the dummy gate structure DG, and a secondcontact 156 b connected to the fourth source/drain region SD4 disposedbetween the second gate structure G2 and the dummy gate structure DG.The first contact 156 a may be provided between the first gate structureG1 and the dummy gate structure DG, and the second contact 156 b may beprovided between the second gate structure G2 and the dummy gatestructure DG. According to some example embodiments, the first contact156 a and the second contact 156 b may have bar shapes extending in thefirst direction D1. The first contact 156 a and the second contact 156 bmay be adjacent to each other with the dummy gate structure DGinterposed therebetween. The first and second contacts 156 a and 156 bmay be spaced apart from the connection contact 150 in the firstdirection D1.

Referring to FIG. 2, the first contact 156 a, the second contact 156 b,and the connection contact 150 may have a first width W1, a second widthW2, and a third width W3 in the second direction D2, respectively. Thefirst width W1 may be substantially equal to the second width W2. Thethird width W3 may be greater than a total of the first width W1 and thesecond width W2.

According to some example embodiments, the first gate structure G1, thesecond gate structure G2, and the dummy gate structure DG may intersectthe two cells C1 and C3 adjacent to each other. In this case, theconnection contact 150 may be provided in the first logic cell C1, andthe first and second contacts 156 a and 156 b may be provided in thethird logic cell C3. The cell boundary CB between the two cells C1 andC3 may be provided between the connection contact 150 and the first andsecond contact plugs 156 a and 156 b adjacent to the connection contact150.

The connection contact 150 may be connected in common to the firsttransistor TR1 and the second transistor TR2 which are adjacent to eachother with the dummy gate structure DG interposed therebetween. Theconnection contact 150 may be connected to one terminal of the firsttransistor TR1 and one terminal of the second transistor TR2. The firstand second transistors TR1 and TR2 may be included in the first logiccell C1. The first and second contacts 156 a and 156 b may berespectively connected to the third transistor TR3 and the fourthtransistor TR4 which are adjacent to each other with the dummy gatestructure DG interposed therebetween. The first contact 156 a may beconnected to one terminal of the third transistor TR3, and the secondcontact 156 b may be connected to one terminal of the fourth transistorTR4. The third and fourth transistors TR3 and TR4 may be included in thethird logic cell C3.

According to other example embodiments, the dummy gate structure DG maybe provided on the cell boundary CB between the first logic cell C1 andthe second logic cell C2 and between the third logic cell C3 and thefourth logic cell C4. The first gate structure G1 may intersect thefirst and third logic cells C1 and C3 adjacent to each other in thefirst direction D1, and the second gate structure G2 may intersect thesecond and fourth logic cells C2 and C4 adjacent to each other in thefirst direction D1. In this case, the connection contact 150 may beshared by the first logic cell C1 and the second logic cell C2 which areadjacent to each other in the second direction D2. In other words, theconnection contact 150 may be connected in common to the firsttransistor TR1 provided in the first logic cell C1 and the secondtransistor TR2 provided in the second logic cell C2. The connectioncontact 150 may be connected to one terminal of the first transistor TR1and one terminal of the second transistor TR2. The first contact 156 amay be connected to the third transistor TR3 provided in the third logiccell C3, and the second contact 156 b may be connected to the fourthtransistor TR4 provided in the fourth logic cell C4. The first contact156 a may be connected to one terminal of the third transistor TR3, andthe second contact 156 b may be connected to one terminal of the fourthtransistor TR4. The cell boundary CB between the first and third logiccells C1 and C3 and between the second and fourth logic cells C2 and C4may be interposed between the connection contact 150 and the first andsecond contacts 156 a and 156 b adjacent to the connection contact 150.

In the event that one dummy gate structure DG is provided between thefirst and second gate structures G1 and G2 adjacent to each other,contacts may be needed to apply voltages to the source/drain regions SD1and SD3 between the first gate structure G1 and the dummy gate structureDG and the source/drain regions SD2 and SD4 between the second gatestructure G2 and the dummy gate structure DG, respectively. If fourcontacts respectively connected to the source/drain regions SD1, SD2,SD3, and SD4 are disposed with one dummy gate structure DG interposedtherebetween, the four contacts may be formed using photo masksdifferent from each other due to limitation of resolution of aphotolithography technique. In this case, a manufacture cost of asemiconductor device may be increased by a plurality of the photo masks.

According to example embodiments of the inventive concepts, as shown inFIGS. 3A and 3B, the first source/drain region SD1 between the first anddummy gate structures G1 and DG and the second source/drain region SD2between the second and dummy gate structures G2 and DG may be connectedin common to the connection contact 150. In addition, the thirdsource/drain region SD3 between the first and dummy gate structures G1and DG and the fourth source/drain region SD4 between the second anddummy gate structures G2 and DG may be connected to the first contact156 a and the second contact 156 b, respectively. In other words, threecontacts 150, 156 a, and 156 b may be used to apply voltages to foursource/drain regions SD1, SD2, SD3, and SD4 which are spaced apart fromeach other with one dummy gate structure DG interposed therebetween.Thus, the number of photo masks used for forming the contacts 150, 156a, and 156 b may be reduced, so a manufacture cost of the semiconductordevice may be reduced. In addition, the contacts 150, 156 a, and 156 bmay be easily formed using different photo masks.

Gate contacts 158 may be provided on the gate structures G. The gatecontacts 158 may be electrically connected to the gate structures G.Each of the gate contacts 158 may be in direct contact with the gateelectrode 110 of each of the gate structures G. Top surfaces of the gatecontacts 158 may be disposed at the substantially same level as the topsurfaces of the connection contact 150 and the source/drain contacts156. The gate contacts 158 may include the same material as thesource/drain contacts 156 and the connection contact 150. For example,the gate contacts 158 may include at least one of a doped semiconductor,a metal, a metal silicide, or a conductive metal nitride. The gatecontacts 158 may not be provided on the dummy gate structure DG.

The source/drain contacts 156, the connection contact 150, and the gatecontacts 158 may be provided in a first interlayer insulating layer 120.For example, the first interlayer insulating layer 120 may include atleast one of a silicon oxide layer and a silicon oxynitride layer. Thetop surfaces of the source/drain contacts 156, the connection contact150, and the gate contacts 158 may be substantially coplanar with a topsurface of the first interlayer insulating layer 120.

Referring to FIG. 3D, a second interlayer insulating layer 170 may beprovided on the first interlayer insulating layer 120. For example, thesecond interlayer insulating layer 170 may include at least one of asilicon oxide layer and a silicon oxynitride layer. Via-contacts VC maybe provided in the second interlayer insulating layer 170. Thesource/drain contacts 156, the connection contact 150, and the gatecontacts 158 may be connected to conductive lines provided on the secondinterlayer insulating layer 170 through the via-contacts VCcorresponding thereto. The conductive lines may include commonconductive lines PW1 and PW2, first conductive lines (not shown), andsecond conductive lines (not shown), which will be described later. Thevia-contacts VC may include a conductive material. In other exampleembodiments, the via-contacts VC may be omitted and the conductive linesmay be connected directly to the source/drain contacts 156, theconnection contact 150, and the gate contacts 158.

Referring to FIG. 2, a first common conductive line PW1 and a secondcommon conductive line PW2 may be provided on the second interlayerinsulating layer 170. The first common conductive line PW1 may overlapwith the PMOSFET region PR, and the second common conductive line PW2may overlap with the NMOSFET region NR when viewed from a plan view. Thefirst and second common conductive lines PW1 and PW2 may extend in thesecond direction D2 and may be spaced apart from each other in the firstdirection D1. The first and second common conductive lines PW1 and PW2may be shared by the logic cells C1 and C2 which are adjacent to eachother in the second direction D2. In some example embodiments, the firstand second common conductive lines PW1 and PW2 may not be shared by thelogic cells C1 and C3 which are adjacent to each other in the firstdirection D1, as illustrated in FIG. 2. However, example embodiments ofthe inventive concepts are not limited thereto. In other exampleembodiments, unlike FIG. 2, the first and second common conductive linesPW1 and PW2 may be shared by the logic cells C1 and C3 which areadjacent to each other in the first direction D1. In FIG. 2, the PMOSFETregion PR of the first logic cell C1 may be adjacent to the PMOSFETregion PR of the third logic cell C3 in the first direction D1.Alternately, the PMOSFET region PR of the first logic cell C1 may beadjacent to the NMOSFET region NR of the third logic cell C3 in thefirst direction when the first and second common conductive lines PW1and PW2 are not shared by the logic cells C1 and C3 adjacent to eachother in the first direction D1.

The connection contact 150 may be connected to one of the first andsecond common conductive lines PW1 and PW2. According to an exampleembodiment, the connection contact 150 may be provided on the PMOSFETregion PR so as to be connected to the first common conductive line PW1,as illustrated in FIG. 2. Alternatively, unlike FIG. 2, the connectioncontact 150 may be provided on the NMOSFET region NR so as to beconnected to the second common conductive line PW2.

The connection contact 150 may be connected to one of the first andsecond common conductive lines PW1 and PW2 through the via-contact VCcorresponding to the connection contact 150. In other embodiments, thevia-contact VC may be omitted and the connection contact 150 may beconnected directly to one of the first and second common conductivelines PW1 and PW2.

According to an example embodiment, the first common conductive line PW1may provide a drain voltage (Vdd; e.g., a power voltage) to thesource/drain regions SD through the via-contact VC and the connectioncontact 150 in the PMOSFET region PR. In more detail, the first commonconductive line PW1 may apply the same drain voltage to the first andsecond source/drain regions SD1 and SD2 which are connected in common tothe connection contact 150. In other words, the first common conductiveline PW1 may apply the same drain voltage to the first and secondtransistors TR1 and TR2 sharing the connection contact 150. In otherexample embodiments, unlike FIG. 2, the second common conductive linePW2 may provide a source voltage (Vss; e.g., a ground voltage) to thesource/drain regions SD through the via-contact VC and the connectioncontact 150 in the NMOSFET region NR. In more detail, the second commonconductive line PW2 may apply the same ground voltage to the first andsecond source/drain regions SD1 and SD2 which are connected in common tothe connection contact 150. In other words, the second common conductiveline PW2 may apply the same ground voltage to the first and secondtransistors TR1 and TR2 sharing the connection contact 150.

At least one of the source/drain contacts 156 may be connected to thefirst common conductive line PW1 or the second common conductive linePW2. According to an example embodiment, at least one of thesource/drain contacts 156 may be provided on the NMOSFET region NR so asto be connected to the second common conductive line PW2. Alternatively,at least one of the source/drain contacts 156 may be provided on thePMOSFET region PR so as to be connected to the first common conductiveline PW1.

At least one of the source/drain contacts 156 may be connected to thefirst common conductive line PW1 or the second common conductive linePW2 through a corresponding via-contact VC. In other exampleembodiments, the via-contact VC may be omitted and at least one of thesource/drain contacts 156 may be connected directly to the first commonconductive line PW1 or the second common conductive line PW2.

The source/drain contacts 156 not connected to the first and secondcommon conductive lines PW1 and PW2 may be connected to first conductivelines (not shown) provided on the second interlayer insulating layer170. According to an example embodiment, the first and second contacts156 a and 156 b may be connected to the first conductive lines. Thefirst conductive lines may be connected to a plurality of source/draincontacts 156. The first conductive lines may apply the same voltage tothe source/drain regions SD through the source/drain contacts 156connected to the first conductive lines. In addition, second conductivelines (not shown) connected to the gate contacts 158 may be provided onthe second interlayer insulating layer 170. The second conductive linesmay apply a gate voltage to the gate structures G through the gatecontacts 158. Positions and the numbers of the first and secondconductive lines may be determined depending on a design of the logiccells C1, C2, C3, and C4 performing the Boolean logic function and/orthe storage function.

The first and second common conductive lines PW1 and PW2 and the firstand second conductive lines may include at least one of a dopedsemiconductor, a conductive metal nitride, or a metal.

FIGS. 4A to 8A to 8D are cross-sectional views illustrating a method ofmanufacturing a semiconductor device according to some embodiments ofthe inventive concepts. FIGS. 4A, 5A, 6A, 7A and 8A are cross-sectionalviews corresponding to the line I-I′ of FIG. 2, and FIGS. 4B, 5B, 6B, 7Band 8B are cross-sectional views corresponding to the line II-II′ ofFIG. 2. FIGS. 4C, 5C, 6C, 7C and 8C are cross-sectional viewscorresponding to the line III-III′ of FIG. 2, and FIGS. 4D, 5D, 6D, 7Dand 8D are cross-sectional views corresponding to the line IV-IV′ ofFIG. 2.

Referring to FIGS. 2 and 4A to 4D, a first device isolation layer ST1and a second device isolation layer ST2 may be formed in a substrate100. For example, the substrate 100 may be a silicon substrate, agermanium substrate, or a silicon-on-insulator (SOI) substrate. Thefirst device isolation layer ST1 may separate a PMOSFET region PR froman NMOSFET region NR in a first logic cell C1. The second deviceisolation layer ST2 may separate the first logic cell C1 from othercells C2, C3, and C4 adjacent to the first logic cell C1. The first andsecond device isolation layers ST1 and ST2 may have depths in adirection vertical to a top surface of the substrate 100. The depth ofthe second device isolation layer ST2 may be substantially equal to, orgreater than, the depth of the first device isolation layer ST1. Thefirst and second device isolation layers ST1 and ST2 may be formed by ashallow trench isolation (STI) process.

Third device isolation layers ST3 may be formed in the substrate 100.The third device isolation layers ST3 may extend in the second directionD2 to define active patterns AP in the PMOSFET region PR and the NMOSFETregion NR. In some example embodiments, each of the active patterns APmay have an upper portion (hereinafter, referred to as ‘an active finAF’) which are exposed by the third device isolation layers ST3. Thethird device isolation layers ST3 may be formed by a STI process. Thethird device isolation layers ST3 may have depths in the directionvertical to the top surface of the substrate 100. The depths of thethird device isolation layers ST3 may be smaller than those of the firstand second device isolation layers ST1 and ST2. In other exampleembodiments, the first to third device isolation layers ST1, ST2, andST3 may be formed at the same time to have the depths equal to eachother. The first to third device isolation layers ST1, ST2, and ST3 mayinclude, for example, a silicon oxide layer.

Referring to FIGS. 2 and 5A to 5D, gate structures G may be formed onthe active patterns AP. The gate structures G may extend in the firstdirection D1 to intersect the active patterns AP. The gate structures Gmay extend in the first direction D1 to intersect the PMOSFET region PRand the NMOSFET region NR and may be arranged along the second directionD2. The gate structures G may extend in the first direction D1 tointersect the first and third logic cells C1 and C3 which are adjacentto each other in the first direction D1. Each of the gate structures Gmay include a gate insulating pattern 102, a gate electrode 110, and acapping pattern 104 which are sequentially stacked on the substrate 100.In some example embodiments, a gate insulating layer, a gate electrodelayer, and a capping layer may be sequentially formed on the substrate100, and a patterning process may be performed on the capping layer, thegate electrode layer, and the gate insulating layer to form the gateinsulating pattern 102, the gate electrode 110, and the capping pattern104. The gate insulating layer, the gate electrode layer, and thecapping layer may be formed by a chemical vapor deposition (CVD) processand/or a sputtering process. Each of the gate structures G may furtherinclude gate spacers 106 that are provided on both sidewalls of the gateelectrode 110. A spacer layer may be deposited to cover the gateelectrodes 110, and the deposited spacer layer may be anisotropicallyetched to form the gate spacers 106.

A dummy gate structure DG may be formed between a pair of gatestructures G adjacent to each other. The dummy gate structure DG mayextend in the first direction D1. The pair of gate structures G mayinclude a first gate structure G1 disposed at one side of the dummy gatestructure DG and a second gate structure G2 disposed at another side ofthe dummy gate structure DG. The dummy gate structure DG may include thesame materials as each of the gate structures G. For example, the dummygate structure DG may include a gate insulating pattern 102, a dummygate pattern 110D, and a capping pattern 104 which are sequentiallystacked on the substrate 100. The dummy gate structure DG may furtherinclude gate spacers 106 provided on both sidewalls of the dummy gatepattern 110D. The dummy gate structure DG may be formed by thesubstantially same process as the gate structures G. The dummy gatestructure DG may be formed simultaneously with the gate structures G.

Ion implantation processes may be performed on the substrate having thegate structures G and the dummy gate structure DG to form source/drainregions SD. The source/drain regions SD may be formed in the activepatterns AP at both sides of each of the gate electrodes G. Thesource/drain regions SD may not be formed in portions of the activepatterns AP that are disposed under the gate structures G to overlapwith the gate structures G. In the PMOSFET region PR, the source/drainregions SD may be formed by implanting P-type dopant ions. In theNMOSFET regions NR, the source/drain regions SD may be formed byimplanting N-type dopant ions.

The source/drain regions SD may include first source/drain regions SD1provided at both sides of the first gate structure G1 and secondsource/drain regions SD2 provided at both sides of the second gatestructure G2. The source/drain regions SD may further include thirdsource/drain regions SD3 provided at both sides of the first gatestructure G1 and fourth source/drain regions SD4 provided at both sidesof the second gate structure G2. The third source/drain regions SD3 maybe spaced apart from the first source/drain regions SD1 in the firstdirection D1, and the fourth source/drain regions SD4 may be spacedapart from the second source/drain regions SD2 in the first directionD1.

Referring to FIGS. 2 and 6A to 6D, a first interlayer insulating layer120 may be formed on the substrate 100 to cover the gate structures Gand the dummy gate structure DG. The first interlayer insulating layer120 may include at least one of a silicon oxide layer or a siliconoxynitride layer.

A first hole H1 may be formed to penetrate the first interlayerinsulating layer 120. The first hole H1 may expose the thirdsource/drain region SD3 between the first gate structure G1 and thedummy gate structure DG. The first hole H1 may have a groove shapeextending in the first direction D1. Forming the first hole H1 mayinclude patterning the first interlayer insulating layer 120 using afirst photo mask defining the first hole H1. After the formation of thefirst hole H1, a first sacrificial layer 122 filling the first hole H1may be formed on the first interlayer insulating layer 120. The firstsacrificial layer 122 may include, for example, a spin-on-hardmask (SOH)material.

After the formation of the first sacrificial layer 122, a second hole H2may be formed to penetrate the first sacrificial layer 122 and the firstinterlayer insulating layer 120. The second hole H2 may expose thefourth source/drain region SD4 between the second gate structure G2 andthe dummy gate structure DG. The second hole H2 may have a groove shapeextending in the first direction D1. Forming the second hole H2 mayinclude patterning the first sacrificial layer 122 and the firstinterlayer insulating layer 120 using a second photo mask defining thesecond hole H2.

Referring to FIGS. 2 and 7A to 7D, the first sacrificial layer 122 maybe removed. The removal of the first sacrificial 122 may be performedusing an ashing process and/or a strip process. After the removal of thefirst sacrificial layer 122, a second sacrificial layer 124 may beformed on the first interlayer insulating layer 120 to fill the firstand second holes H1 and H2. The second sacrificial layer 124 mayinclude, for example, a SOH material. In some example embodiments, thefirst sacrificial layer 122 may not be removed before the formation ofthe second sacrificial layer 124. In this case, the second sacrificiallayer 124 may be formed on the first sacrificial layer 122 to fill thesecond hole H2.

After the formation of the second sacrificial layer 124, a third hole H3may be formed to expose the first source/drain region SD1 between thefirst gate structure G1 and the dummy gate structure DG, the secondsource/drain region SD2 between the second gate structure G2 and thedummy gate structure DG, and a top surface of the dummy gate structureDG. The third hole H3 may include a horizontal through-portion HPextending in the second direction D2, and vertical through-portions VPextending from the horizontal through-portion HP toward the top surfaceof the substrate 100. The vertical through-portions VP may expose thefirst source/drain region SD1 and the second source/drain region SD2,respectively. Forming the third hole H3 may include patterning thesecond sacrificial layer 124 and the first interlayer insulating layer120 using a third photo mask defining the third hole H3. The first,second, and third holes H1, H2, and H3 may be formed using differentphoto masks from each other, and a formation order of the first to thirdholes H1, H2, and H3 may not be limited to the above descriptions. Inother example embodiments, the third hole H3 may be formed before theformation of the first and second holes H1 and H2. Additional holes (notshown) may be formed in the first interlayer insulating layer 120 toexpose the source/drain regions SD except the first to fourthsource/drain regions SD1, SD2, SD3 and SD4. One or more of theadditional holes may be formed using the same photo mask with the firsthole H1. One or more of the additional holes may be formed using thesame photo mask with the second hole H2. One or more of the additionalholes may be formed using the same photo mask with the third hole H3.

Referring to FIGS. 2 and 8A to 8D, the second sacrificial layer 124 maybe removed. The removal of the second sacrificial layer 124 may beperformed using an ashing process and/or a strip process. After theremoval of the second sacrificial layer 124, a third sacrificial layer(not shown) may be formed on the first interlayer insulating layer 120to cover the first to third holes H1, H2, and H3 and the additionalholes. The third sacrificial layer may include, for example, a SOHmaterial. After the formation of the third sacrificial layer, fourthholes H4 may be formed to penetrate the third sacrificial layer and thefirst interlayer insulating layer 120. The fourth holes H4 may exposethe gate electrodes 110 of the gate structures G, respectively.Thereafter, the third sacrificial layer may be removed. The thirdsacrificial layer may be removed by an ashing process and/or a stripprocess.

A conductive layer may be formed on the first interlayer insulatinglayer 120 to fill the first to fourth holes H1, H2, H3, and H4 and theadditional holes. For example, the conductive layer may include a dopedsemiconductor, a metal, a metal silicide, or a conductive metal nitride.The conductive layer may be planarized until the first interlayerinsulating layer 120 is exposed, thereby forming source/drain contacts156 in the first and second holes H1 and H2 and the additional holes, aconnection contact 150 in the third hole H3, and gate contacts 158 inthe fourth holes H4. The source/drain contacts 156 may include a firstcontact 156 a provided in the first hole H1 and a second contact 156 bprovided in the second hole H2. The connection contact 150 may include ahorizontal extension HE provided on the top surface of the dummy gatestructure DG to extend in the second direction D2, and verticalextensions VE extending from the horizontal extension HE to top surfacesof the first and second source/drain regions SD1 and SD2, respectively.According to an example embodiment, the gate contacts 158 may be formedsimultaneously with the source/drain contacts 156 and the connectioncontact 150. Due to the planarization process, top surfaces of thesource/drain contacts 156, the connection contact 150, and the gatecontacts 158 may be disposed at the substantially same level.

Referring again to FIGS. 2 and 3A to 3D, a second interlayer insulatinglayer 170 may be formed on the resultant structure having thesource/drain contacts 156, the connection contact 150, and the gatecontacts 158. For example, the second interlayer insulating layer 170may include at least one of a silicon oxide layer and a siliconoxynitride layer. Via-contacts VC may be formed in the second interlayerinsulating layer 170. The via-contacts VC may be formed to correspond tothe source/drain contacts 156, the connection contact 150, and the gatecontacts 158, respectively.

First and second common conductive lines PW1 and PW2 may be formed onthe second interlayer insulating layer 170. The first and second commonconductive lines PW1 and PW2 may extend in the second direction D2 andmay be spaced apart from each other in the first direction D1. The firstand second common conductive lines PW1 and PW2 may be shared by thelogic cells C1 and C2 adjacent to each other in the second direction D2.The connection contact 150 may be connected to one of the first andsecond common conductive lines PW1 and PW2 through the via-contact VCcorresponding to the connection contact 150. First conductive lines (notshown) connected to the source/drain contacts 156 and second conductivelines (not shown) connected to the gate contacts 158 may be formed onthe second interlayer insulating layer 170. The first and secondcontacts 156 a and 156 b may be connected to the first conductive linesthrough the via-contacts VC corresponding to the first and secondcontacts 156 a and 156 b. The gate contacts 158 may be connected to thesecond conductive lines through the via-contacts VC corresponding to thegate contacts 158. The first and second common conductive lines PW1 andPW2 and the first and second conductive lines may include at least oneof a doped semiconductor, a conductive metal nitride, or a metal.

According to some example embodiments of the inventive concepts, threecontacts 150, 156 a, and 156 b may be formed to apply voltages to foursource/drain regions SD1, SD2, SD3, and SD4 which are spaced apart fromeach other with one dummy gate structure DG interposed therebetween.Thus, the number of the photo masks used for forming the contacts 150,156 a, and 156 b may be reduced. This means that the manufacture cost ofthe semiconductor device may be reduced.

In the above example embodiments, the active patterns AP may have finshapes. However, example embodiments of the inventive concepts are notlimited thereto. The shapes of the active patterns AP may be variouslymodified.

FIG. 9 is a conceptual diagram illustrating an active pattern of asemiconductor device according to other example embodiments of theinventive concepts.

In the present example embodiments, a cross section of an active patternAP may have an omega shape that includes a neck portion NC adjacent to asubstrate 100 and a body portion BD having a width wider than that ofthe neck portion NC. A gate insulating pattern 102 and a gate electrode110 may be sequentially provided on the active pattern AP. A portion ofthe gate electrode 110 may extend under the body portion BD of theactive pattern AP.

FIG. 10 is a conceptual diagram illustrating an active pattern of asemiconductor device according to still other example embodiments of theinventive concepts.

In the present example embodiments, an active pattern AP may have anano-wire shape spaced apart from a substrate 100. A gate insulatingpattern 102 and a gate electrode 110 may be sequentially provided on theactive pattern AP. The gate electrode 110 may extend between the activepattern AP and the substrate 100.

FIG. 11 is a schematic block diagram illustrating an electronic systemincluding a semiconductor device according to some example embodimentsof the inventive concepts.

Referring to FIG. 11, an electronic system 1100 according to someexample embodiments of the inventive concepts may include a controller1110, an input/output (I/O) unit 1120, a memory device 1130, aninterface unit 1140, and a data bus 1150. At least two of the controller1110, the I/O unit 1120, the memory device 1130, and the interface unit1140 may communicate with each other through the data bus 1150. The databus 1150 may correspond to a path through which electrical signals aretransmitted.

The controller 1110 may include at least one of a microprocessor, adigital signal processor, a microcontroller, or other logic deviceshaving a similar function to any one thereof. The I/O unit 1120 mayinclude a keypad, a keyboard and/or a display device. The memory device1130 may store data and/or commands. The interface unit 1140 maytransmit electrical data to a communication network or may receiveelectrical data from a communication network. The interface unit 1140may operate by wireless or a cable. For example, the interface unit 1140may include an antenna or a wireless/cable transceiver. Although notshown in the drawings, the electronic system 1100 may further include afast dynamic random access memory (DRAM) device and/or a fast staticrandom access memory (SRAM) device which acts as a cache memory forimproving an operation of the controller 1110. At least one of thesemiconductor devices according to the aforementioned exampleembodiments of the inventive concepts may be provided in the memorydevice 1130, the controller 1110, and/or the I/O unit 1120.

The electronic system 1100 may be applied to a personal digitalassistant (PDA), a portable computer, a web tablet, a wireless phone, amobile phone, a digital music player, a memory card or other electronicproducts. The other electronic products may receive or transmitinformation data by wireless.

According to example embodiments of the inventive concepts, threecontacts may be formed to apply voltages to four source/drain regionswhich are spaced apart from each other with one dummy gate structureinterposed therebetween. Thus, the number of photo masks used inprocesses of forming the contacts may be reduced. This means that themanufacture cost of the semiconductor device may be reduced. Inaddition, the contacts may be easily formed using different photo masksfrom each other.

While the inventive concepts have been described with reference toexample embodiments, it will be apparent to those skilled in the artthat various changes and modifications may be made without departingfrom the spirits and scopes of the inventive concepts. Therefore, itshould be understood that the above embodiments are not limiting, butillustrative. Thus, the scopes of the inventive concepts are to bedetermined by the broadest permissible interpretation of the followingclaims and their equivalents, and shall not be restricted or limited bythe foregoing description.

What is claimed is:
 1. A semiconductor device, comprising: a first gatestructure and a second gate structure extending in a first direction andspaced apart from each other in a second direction intersecting thefirst direction; a dummy gate structure between the first gate structureand the second gate structure, the dummy gate structure extending in thefirst direction; a first source/drain region between the first gatestructure and the dummy gate structure; a second source/drain regionbetween the second gate structure and the dummy gate structure; aconnection contact on the dummy gate structure, the connection contactextending in the second direction to connect the first source/drainregion to the second source/drain region; and a common conductive lineon the connection contact, the common conductive line configured toapply a voltage to the first and second source/drain regions through theconnection contact.
 2. The semiconductor device of claim 1, wherein theconnection contact comprises: a horizontal extension extending in thesecond direction; and vertical extensions extending from the horizontalextension to top surfaces of the first and second source/drain regions,respectively, and bottom surfaces of the vertical extensions are incontact with the first and second source/drain regions, respectively. 3.The semiconductor device of claim 2, wherein a bottom surface of thehorizontal extension is in contact with a top surface of the dummy gatestructure.
 4. The semiconductor device of claim 1, further comprising: avia-contact between the connection contact and the common conductiveline, the common conductive line for applying the same voltage to thefirst and second source/drain regions through the via-contact and theconnection contact.
 5. The semiconductor device of claim 1, furthercomprising: a third source/drain region between the first gate structureand the dummy gate structure, the third source/drain region being spacedapart from the first source/drain region in the first direction; afourth source/drain region between the second gate structure and thedummy gate structure, the fourth source/drain region being spaced apartfrom the second source/drain region in the first direction; a firstcontact between the first gate structure and the dummy gate structure,the first contact being in contact with the third source/drain region;and a second contact between the second gate structure and the dummygate structure, the second contact being in contact with the fourthsource/drain region, top surfaces of the first and second contacts beingat a substantially same level as a top surface of the connectioncontact.
 6. The semiconductor device of claim 5, wherein the firstcontact, the second contact, and the connection contact includeidentical materials.
 7. The semiconductor device of claim 5, wherein thefirst and second contacts have bar shapes extending in the firstdirection, and the first and second contacts are spaced apart from theconnection contact in the first direction.
 8. The semiconductor deviceof claim 5, wherein each of the first contact, the second contact, andthe connection contact has a width in the second direction, and thewidth of the connection contact is greater than the widths of the firstand second contacts.
 9. A semiconductor device, comprising: a dummy gatestructure on a substrate, the dummy gate structure extending in a firstdirection; a first pair of transistors at respective opposing sides ofthe dummy gate structure; a second pair of transistors at the respectiveopposing sides, the second pair of transistors being adjacent to thefirst pair of transistors in the first direction; a connection contacton a top surface of the dummy gate structure, the connection contactextending along both sidewalls of the dummy gate structure so as to beconnected in common to the first pair of transistors; and a firstcontact and a second contact at the respective opposing sides, the firstand second contacts connected to the second pair of transistors,respectively, top surfaces of the first and second contacts being at asubstantially same level as a top surface of the connection contact. 10.The semiconductor device of claim 9, further comprising: a plurality oflogic cells on the substrate, the plurality of logic cells including, afirst logic cell, and a second logic cell spaced apart from the firstlogic cell in the first direction, the dummy gate structure intersectingthe first logic cell and the second logic cell, the first logic cellincluding the first pair of transistors, and the second logic cellincluding the second pair of transistors.
 11. The semiconductor deviceof claim 10, further comprising: a via-contact in contact with the topsurface of the connection contact; and a common conductive line incontact with a top surface of the via-contact, the common conductiveline configured to apply a drain voltage or a source voltage to thefirst pair of transistors through the via-contact and the connectioncontact.
 12. The semiconductor device of claim 9, further comprising: aplurality of logic cells on the substrate, the plurality of logic cellsincluding, a first logic cell, a second logic cell spaced apart from afirst logic cell in a second direction, a third logic cell spaced apartfrom the first logic cell in the first direction, and a fourth logiccell spaced apart from the second logic cell in the first direction, thedummy gate structure being between the first logic cell and the secondlogic cell and between the third logic cell and the fourth logic cell,the first pair of transistors including a first transistor in the firstlogic cell, and a second transistor in the second logic cell, and thesecond pair of transistors including a third transistor in the thirdlogic cell, and a fourth transistor in the fourth logic cell.
 13. Thesemiconductor device of claim 12, further comprising: a via-contact incontact with the top surface of the connection contact; and a commonconductive line in contact with a top surface of the via-contact, thecommon conductive line being shared by the first logic cell and thesecond logic cell.
 14. The semiconductor device of claim 13, wherein thecommon conductive line applies the same voltage to the first and secondtransistors through the via-contact and the connection contact.
 15. Thesemiconductor device of claim 9, wherein the first contact, the secondcontact, and the connection contact include identical materials.
 16. Asemiconductor device, comprising: first and second gate structuresextending in a first direction, the first gate structure beingelectrically connected to a first source/drain region and a secondsource/drain region, and the second gate structure being electricallyconnected to a third source/drain region and a fourth source/drainregion; and a connection contact electrically connecting the firstsource/drain region to the third source/drain region, the connectioncontact extending in the first direction.
 17. The semiconductor deviceof claim 16, further comprising: a dummy gate structure interposedbetween the first and third source/drain regions, and between the secondand fourth source/drain regions, the dummy gate structure extending inthe first direction, the connection contact traversing the dummy gatestructure along a second direction, and the second direction beingsubstantially perpendicular to the first direction.
 18. Thesemiconductor device of claim 16, further comprising: first and secondcontacts each electrically connected to a respective one of the secondand fourth source/drain regions, upper surfaces of the first and secondcontacts being coplanar with an upper surface of the connection contact.19. The semiconductor device of claim 16, further comprising: a commonconductive line electrically connected to the first and second gatestructures via the connection contact and a respective one of the firstand third source/drain regions.